《蒸鍍製程陶瓷零件》與《鍍膜製程陶瓷零件》（如 PVD、CVD、E-beam、Sputter）
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蒸鍍 / 鍍膜製程用陶瓷零件｜高溫真空鍍膜結構件
產品介紹
蒸鍍與鍍膜製程（包含 PVD、CVD、E-beam、Sputtering）廣泛應用於半導體、光電、面板與光學薄膜領域。此類製程需於高溫真空、強電場或等離子環境中進行，陶瓷零件提供絕緣、熱穩定、抗腐蝕與無金屬污染的關鍵支撐與定位功能。
典型陶瓷零件
- 蒸鍍電極絕緣環 / 載具底座
- CVD / PVD 真空陶瓷電極
- 射頻絕緣墊 / Shield Ring / Edge Ring
- 加熱平台隔熱墊 / 真空吸附盤
- 磁控濺鍍陶瓷定位件 / 靜電吸盤
可用陶瓷材料
- 氧化鋁（Al₂O₃）：絕緣性佳、抗熱衝擊
- 碳化矽（SiC）：耐等離子蝕刻、高導熱
- 氮化鋁（AlN）：導熱與絕緣平衡
- 石英（Quartz）：高純度、低熱膨脹
- 抗靜電陶瓷：適用靜電吸盤與防止粒子吸附
應用產線
- 半導體晶圓鍍膜 / 光阻硬膜處理
- OLED、Micro LED 製程模組
- 光學濾光片 / 反射膜鍍製系統
- 太陽能電池背電極鍍膜（Al、Ti、Ag）
Ceramic Parts for Thin Film Deposition Processes (PVD / CVD / E-beam / Sputtering)
Product Overview
Ceramic components are essential in vacuum thin film deposition processes including PVD, CVD, sputtering, and e-beam evaporation. These high-temperature, plasma or RF-powered environments require electrically insulating, thermally stable, chemically resistant parts with zero metal contamination.
Typical Ceramic Applications
- Electrode insulators / base plates
- CVD / PVD ceramic electrodes & chuck holders
- RF isolators, shield rings, edge covers
- Thermal insulation rings / vacuum chuck plates
- ESD-safe electrostatic chuck carriers
Material Options
- Alumina (Al₂O₃): excellent electrical insulator, shock resistant
- Silicon Carbide (SiC): highly plasma-resistant, heat conductive
- Aluminum Nitride (AlN): combines heat conductivity and insulation
- Quartz: ultra-pure, ideal for optical and plasma applications
- ESD-safe ceramics: used for antistatic vacuum handling
Industries Served
- Semiconductor wafer PVD / hardmask / ALD systems
- OLED / Micro LED vacuum deposition
- Optical filter & reflector coating
- Solar cell rear electrode deposition (Al, Ag, Ti, etc.)
-
蒸鍍 / 鍍膜製程用陶瓷零件｜高溫真空鍍膜結構件
產品介紹
蒸鍍與鍍膜製程（包含 PVD、CVD、E-beam、Sputtering）廣泛應用於半導體、光電、面板與光學薄膜領域。此類製程需於高溫真空、強電場或等離子環境中進行，陶瓷零件提供絕緣、熱穩定、抗腐蝕與無金屬污染的關鍵支撐與定位功能。
典型陶瓷零件
- 蒸鍍電極絕緣環 / 載具底座
- CVD / PVD 真空陶瓷電極
- 射頻絕緣墊 / Shield Ring / Edge Ring
- 加熱平台隔熱墊 / 真空吸附盤
- 磁控濺鍍陶瓷定位件 / 靜電吸盤
可用陶瓷材料
- 氧化鋁（Al₂O₃）：絕緣性佳、抗熱衝擊
- 碳化矽（SiC）：耐等離子蝕刻、高導熱
- 氮化鋁（AlN）：導熱與絕緣平衡
- 石英（Quartz）：高純度、低熱膨脹
- 抗靜電陶瓷：適用靜電吸盤與防止粒子吸附
應用產線
- 半導體晶圓鍍膜 / 光阻硬膜處理
- OLED、Micro LED 製程模組
- 光學濾光片 / 反射膜鍍製系統
- 太陽能電池背電極鍍膜（Al、Ti、Ag）
Ceramic Parts for Thin Film Deposition Processes (PVD / CVD / E-beam / Sputtering)
Product Overview
Ceramic components are essential in vacuum thin film deposition processes including PVD, CVD, sputtering, and e-beam evaporation. These high-temperature, plasma or RF-powered environments require electrically insulating, thermally stable, chemically resistant parts with zero metal contamination.
Typical Ceramic Applications
- Electrode insulators / base plates
- CVD / PVD ceramic electrodes & chuck holders
- RF isolators, shield rings, edge covers
- Thermal insulation rings / vacuum chuck plates
- ESD-safe electrostatic chuck carriers
Material Options
- Alumina (Al₂O₃): excellent electrical insulator, shock resistant
- Silicon Carbide (SiC): highly plasma-resistant, heat conductive
- Aluminum Nitride (AlN): combines heat conductivity and insulation
- Quartz: ultra-pure, ideal for optical and plasma applications
- ESD-safe ceramics: used for antistatic vacuum handling
Industries Served
- Semiconductor wafer PVD / hardmask / ALD systems
- OLED / Micro LED vacuum deposition
- Optical filter & reflector coating
- Solar cell rear electrode deposition (Al, Ag, Ti, etc.)
