陶瓷壓頭（Ceramic Bonding Head / Hot Press Tool）於封裝製程中的應用
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陶瓷壓頭｜半導體封裝製程用熱壓頭
產品介紹
陶瓷壓頭是封裝製程中常見的晶片壓接、熱壓成型、貼合對位設備核心零件。其材質需具備高溫穩定性、熱傳導性、絕緣性與表面潔淨度，以確保製程中高可靠性與零污染。徽亞科技提供氧化鋁、氮化鋁、碳化矽等多種陶瓷壓頭材料選項。
應用製程
- 熱壓貼合（Thermo-compression Bonding, TCB）
- 晶片封裝壓接（Die Bonding, Flip-Chip）
- 覆晶封裝 / BGA / LGA 壓合
- Mini LED、Micro LED 封裝平台
可選材質
- 氧化鋁（Al₂O₃）：絕緣性佳、耐熱穩定
- 氮化鋁（AlN）：高導熱、高硬度、快速升溫
- 碳化矽（SiC）：耐等離子、高熱穩定性
- 抗靜電陶瓷：防止感應式靜電釋放
特點與客製項目
- 可設計壓痕結構、微孔吸附、導電路設計
- 表面鏡面拋光 / 噴砂處理
- 支援熱壓區域分區控溫、複合結構成型
- 搭配金屬框 / 石英視窗設計
Ceramic Bonding Heads for Semiconductor Packaging
Product Overview
Ceramic bonding heads are critical components in packaging processes such as TCB (Thermo-Compression Bonding), die attach, and flip-chip packaging. These tools require thermal stability, surface purity, electrical insulation, and thermal conductivity to ensure defect-free bonding and long-term process reliability.
Packaging Processes
- Thermo-compression bonding (TCB)
- Die bonding & flip-chip attach
- BGA / LGA / wafer-level package bonding
- Mini / Micro LED placement & packaging
Material Options
- Alumina (Al₂O₃): excellent insulator, thermal stability
- Aluminum Nitride (AlN): high thermal conductivity, fast heating
- Silicon Carbide (SiC): robust against plasma, high rigidity
- ESD-safe Ceramic: dissipative for sensitive bonding zones
Features & Customization
- Optional dimpled face, vacuum holes, conductive patterns
- Mirror-polished or textured surfaces
- Multi-zone heating, hybrid composite designs available
- Support for metal frame or quartz viewing window integration
-
陶瓷壓頭｜半導體封裝製程用熱壓頭
產品介紹
陶瓷壓頭是封裝製程中常見的晶片壓接、熱壓成型、貼合對位設備核心零件。其材質需具備高溫穩定性、熱傳導性、絕緣性與表面潔淨度，以確保製程中高可靠性與零污染。徽亞科技提供氧化鋁、氮化鋁、碳化矽等多種陶瓷壓頭材料選項。
應用製程
- 熱壓貼合（Thermo-compression Bonding, TCB）
- 晶片封裝壓接（Die Bonding, Flip-Chip）
- 覆晶封裝 / BGA / LGA 壓合
- Mini LED、Micro LED 封裝平台
可選材質
- 氧化鋁（Al₂O₃）：絕緣性佳、耐熱穩定
- 氮化鋁（AlN）：高導熱、高硬度、快速升溫
- 碳化矽（SiC）：耐等離子、高熱穩定性
- 抗靜電陶瓷：防止感應式靜電釋放
特點與客製項目
- 可設計壓痕結構、微孔吸附、導電路設計
- 表面鏡面拋光 / 噴砂處理
- 支援熱壓區域分區控溫、複合結構成型
- 搭配金屬框 / 石英視窗設計
Ceramic Bonding Heads for Semiconductor Packaging
Product Overview
Ceramic bonding heads are critical components in packaging processes such as TCB (Thermo-Compression Bonding), die attach, and flip-chip packaging. These tools require thermal stability, surface purity, electrical insulation, and thermal conductivity to ensure defect-free bonding and long-term process reliability.
Packaging Processes
- Thermo-compression bonding (TCB)
- Die bonding & flip-chip attach
- BGA / LGA / wafer-level package bonding
- Mini / Micro LED placement & packaging
Material Options
- Alumina (Al₂O₃): excellent insulator, thermal stability
- Aluminum Nitride (AlN): high thermal conductivity, fast heating
- Silicon Carbide (SiC): robust against plasma, high rigidity
- ESD-safe Ceramic: dissipative for sensitive bonding zones
Features & Customization
- Optional dimpled face, vacuum holes, conductive patterns
- Mirror-polished or textured surfaces
- Multi-zone heating, hybrid composite designs available
- Support for metal frame or quartz viewing window integration
