<離子蝕刻製程陶瓷零件>Ceramic Parts for Plasma Etching / Ion Etching Process
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離子蝕刻製程陶瓷零件
產品介紹
徽亞科技專精於製造 離子/電漿蝕刻製程用陶瓷零件，適用於半導體蝕刻機台內部高耗損區域。產品可長時間暴露於等離子體、氟化氣體、高溫、高能離子撞擊的環境中，具備高純度、耐腐蝕、低粒子脫落與尺寸穩定性等特性。
常用陶瓷材料
- 氧化鋁（Al₂O₃）：經濟耐蝕選擇
- 氧化鋯（ZrO₂）：具高抗裂性
- 碳化矽（SiC）：高導熱、超耐蝕
- 氮化鋁（AlN）：具良好絕緣與導熱特性
- 玻璃微晶瓷（MACOR / 可加工陶瓷）：適合小批量試作
應用部位
- ICP / RIE 蝕刻機內部絕緣環、導氣環、固定環
- Upper / Lower Electrode 隔熱墊
- Shield Ring、Edge Ring、Cover Plate、Focus Ring
- 冷卻平台隔熱座 / 真空接合部位
產品優勢
- 等離子體穩定性高，抗氟化物蝕刻氣體
- 表面潔淨度高，低粒子釋出
- 尺寸穩定、可重複安裝
- 支援複雜結構加工與抗靜電功能
Ceramic Parts for Plasma Etching & Ion Etching Process
Product Overview
Huiya Technology manufactures high-purity ceramic components for dry etching processes, including plasma etching (ICP/RIE) and ion etching tools. Our materials are optimized for plasma exposure, fluorine gas resistance, ion bombardment, and thermal stability in semiconductor applications.
Recommended Materials
- Alumina (Al₂O₃): cost-effective, corrosion resistant
- Zirconia (ZrO₂): high toughness and strength
- Silicon Carbide (SiC): excellent plasma resistance, thermal conductivity
- Aluminum Nitride (AlN): thermal management with insulation
- Machinable Glass Ceramic (MACOR): suitable for prototypes and small batches
Application Zones
- ICP / RIE inner rings, insulators, gas guide rings
- Electrode thermal insulators (upper/lower)
- Shield rings, edge rings, focus rings, cover plates
- Cooling stage interfaces, vacuum bonding parts
Advantages
- High plasma resistance, stable in fluorinated gases
- Ultra-low particle generation, cleanroom ready
- Precision tolerances and long service life
- Custom shapes, optional ESD-safe formulas available
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離子蝕刻製程陶瓷零件
產品介紹
徽亞科技專精於製造 離子/電漿蝕刻製程用陶瓷零件，適用於半導體蝕刻機台內部高耗損區域。產品可長時間暴露於等離子體、氟化氣體、高溫、高能離子撞擊的環境中，具備高純度、耐腐蝕、低粒子脫落與尺寸穩定性等特性。
常用陶瓷材料
- 氧化鋁（Al₂O₃）：經濟耐蝕選擇
- 氧化鋯（ZrO₂）：具高抗裂性
- 碳化矽（SiC）：高導熱、超耐蝕
- 氮化鋁（AlN）：具良好絕緣與導熱特性
- 玻璃微晶瓷（MACOR / 可加工陶瓷）：適合小批量試作
應用部位
- ICP / RIE 蝕刻機內部絕緣環、導氣環、固定環
- Upper / Lower Electrode 隔熱墊
- Shield Ring、Edge Ring、Cover Plate、Focus Ring
- 冷卻平台隔熱座 / 真空接合部位
產品優勢
- 等離子體穩定性高，抗氟化物蝕刻氣體
- 表面潔淨度高，低粒子釋出
- 尺寸穩定、可重複安裝
- 支援複雜結構加工與抗靜電功能
Ceramic Parts for Plasma Etching & Ion Etching Process
Product Overview
Huiya Technology manufactures high-purity ceramic components for dry etching processes, including plasma etching (ICP/RIE) and ion etching tools. Our materials are optimized for plasma exposure, fluorine gas resistance, ion bombardment, and thermal stability in semiconductor applications.
Recommended Materials
- Alumina (Al₂O₃): cost-effective, corrosion resistant
- Zirconia (ZrO₂): high toughness and strength
- Silicon Carbide (SiC): excellent plasma resistance, thermal conductivity
- Aluminum Nitride (AlN): thermal management with insulation
- Machinable Glass Ceramic (MACOR): suitable for prototypes and small batches
Application Zones
- ICP / RIE inner rings, insulators, gas guide rings
- Electrode thermal insulators (upper/lower)
- Shield rings, edge rings, focus rings, cover plates
- Cooling stage interfaces, vacuum bonding parts
Advantages
- High plasma resistance, stable in fluorinated gases
- Ultra-low particle generation, cleanroom ready
- Precision tolerances and long service life
- Custom shapes, optional ESD-safe formulas available
