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陶瓷手臂 & 一體成型抗靜電陶瓷手臂
產品介紹
徽亞科技專精於高性能陶瓷手臂設計與製造,提供 陶瓷手臂 與 一體成型全抗靜電陶瓷手臂 兩種選項, 適用於晶圓搬運、自動化機構、雷射對位與高潔淨真空環境,符合先進製程與靜電安全要求。
陶瓷手臂
- 材質:氧化鋁(Al₂O₃)、氮化鋁(AlN)、氮化矽(Si₃N₄)
- 特性:高剛性、耐高溫、絕緣、不變形
- 應用:晶圓吸附、雷射設備定位、真空搬運
- 客製項目:真空孔、吸附槽、倒角、鏡面拋光
一體成型抗靜電陶瓷手臂
- 材質:全體燒結靜電耗散型陶瓷(非塗層)
- 電阻值:10⁵ ~ 10⁹ Ω·cm,可依需求調整
- 優點:無塗層剝落風險、不導電、不感應、不積電
- 特性:耐磨耗、高潔淨、抗靜電、可重複清洗使用
應用產業
- 晶圓搬運與對位
- 雷射貼合 / 半導體封裝設備
- 自動化模組手臂結構
- ESD 控制與無塵室設備
Ceramic Arms & Monolithic ESD-safe Ceramic Arms
Product Overview
Huiya Technology specializes in high-performance ceramic arm solutions, including standard ceramic arms and fully sintered monolithic ESD-safe ceramic arms. These are ideal for wafer transfer, vacuum pick-up, laser alignment, and ESD-critical environments in semiconductor and automation fields.
Ceramic Arm
- Materials: Alumina (Al₂O₃), Aluminum Nitride (AlN), Silicon Nitride (Si₃N₄)
- Features: High stiffness, insulating, heat-resistant, dimensionally stable
- Applications: Wafer handling, vacuum systems, optical alignment stages
- Customizations: Vacuum holes, mounting slots, chamfers, polished surface
Monolithic ESD-safe Ceramic Arm
- Material: Bulk static-dissipative ceramic (non-coated)
- Resistivity: 10⁵ to 10⁹ Ω·cm adjustable
- Advantages: No coating flake-off, anti-induction, durable, safe for cleanroom use
- Use Case: ESD-sensitive semiconductor packaging and wafer transfer
Industries Served
- Semiconductor wafer handling and alignment
- Laser bonding and packaging tools
- Automated clean arm systems
- ESD-controlled and cleanroom facilities
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陶瓷手臂 & 一體成型抗靜電陶瓷手臂
產品介紹
徽亞科技專精於高性能陶瓷手臂設計與製造,提供 陶瓷手臂 與 一體成型全抗靜電陶瓷手臂 兩種選項, 適用於晶圓搬運、自動化機構、雷射對位與高潔淨真空環境,符合先進製程與靜電安全要求。
陶瓷手臂
- 材質:氧化鋁(Al₂O₃)、氮化鋁(AlN)、氮化矽(Si₃N₄)
- 特性:高剛性、耐高溫、絕緣、不變形
- 應用:晶圓吸附、雷射設備定位、真空搬運
- 客製項目:真空孔、吸附槽、倒角、鏡面拋光
一體成型抗靜電陶瓷手臂
- 材質:全體燒結靜電耗散型陶瓷(非塗層)
- 電阻值:10⁵ ~ 10⁹ Ω·cm,可依需求調整
- 優點:無塗層剝落風險、不導電、不感應、不積電
- 特性:耐磨耗、高潔淨、抗靜電、可重複清洗使用
應用產業
- 晶圓搬運與對位
- 雷射貼合 / 半導體封裝設備
- 自動化模組手臂結構
- ESD 控制與無塵室設備
Ceramic Arms & Monolithic ESD-safe Ceramic Arms
Product Overview
Huiya Technology specializes in high-performance ceramic arm solutions, including standard ceramic arms and fully sintered monolithic ESD-safe ceramic arms. These are ideal for wafer transfer, vacuum pick-up, laser alignment, and ESD-critical environments in semiconductor and automation fields.
Ceramic Arm
- Materials: Alumina (Al₂O₃), Aluminum Nitride (AlN), Silicon Nitride (Si₃N₄)
- Features: High stiffness, insulating, heat-resistant, dimensionally stable
- Applications: Wafer handling, vacuum systems, optical alignment stages
- Customizations: Vacuum holes, mounting slots, chamfers, polished surface
Monolithic ESD-safe Ceramic Arm
- Material: Bulk static-dissipative ceramic (non-coated)
- Resistivity: 10⁵ to 10⁹ Ω·cm adjustable
- Advantages: No coating flake-off, anti-induction, durable, safe for cleanroom use
- Use Case: ESD-sensitive semiconductor packaging and wafer transfer
Industries Served
- Semiconductor wafer handling and alignment
- Laser bonding and packaging tools
- Automated clean arm systems
- ESD-controlled and cleanroom facilities