研磨拋光製程陶瓷零件（Ceramic Parts for CMP / Polishing / Lapping)
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研磨拋光製程陶瓷零件｜高潔淨高硬度機構件
產品介紹
研磨拋光製程（CMP / Lapping / Polishing）廣泛應用於半導體晶圓表面處理、光學鏡片、陶瓷基板與金屬膜平坦化等工藝。此類製程對設備零件的硬度、潔淨度、尺寸穩定與耐磨性要求極高。徽亞科技提供一系列高性能陶瓷零件，支援長時間使用與化學穩定性需求。
常見陶瓷零件類型
- 載具環（Retaining Ring）
- 導水環 / 擋液罩（Splash Ring / Barrier）
- 壓板襯墊（Backing Plate / Pad Support）
- 拋光平台基座 / 保護蓋板（Polishing Base / Top Plate）
- 研磨定位塊、吸附定位結構件
可用材料
- 氧化鋁（Al₂O₃）：高硬度、高耐磨、性價比高
- 碳化矽（SiC）：極高耐化學性與機械強度
- 氮化鋁（AlN）：適用熱平衡載板與導熱模組
- 抗靜電陶瓷：避免顆粒靜電吸附，提升潔淨度
- 工程塑膠（如 PEEK）：用於襯墊與導水環等非結構件
應用產業
- 半導體晶圓 CMP 拋光設備
- 光學玻璃、藍寶石基板加工
- 精密金屬表面研磨與鍍層整平
- 高端拋光機 / 自動化加工平台
Ceramic Components for Polishing & Grinding Process
Product Overview
The polishing and grinding process (CMP / Lapping / Surface Finishing) plays a key role in wafer surface preparation, optical substrate processing, and precision film planarization. These systems demand wear-resistant, ultra-clean, and dimensionally stable ceramic parts for reliable performance in abrasive and chemical environments.
Typical Ceramic Parts
- Retaining Rings
- Splash Barriers / Liquid Shields
- Back Pads / Pressure Plates
- Polishing Base Plates / Top Covers
- Positioning Guides / Suction Fixtures
Available Materials
- Alumina (Al₂O₃): high hardness and wear resistance
- Silicon Carbide (SiC): top chemical resistance and rigidity
- Aluminum Nitride (AlN): thermal balance and base plate use
- ESD-safe ceramics: avoid particle electrostatic attraction
- PEEK / PTFE: used in non-structural buffer or drainage parts
Industries Served
- Semiconductor CMP wafer tools
- Optical & sapphire substrate polishing
- Precision metal grinding and film leveling
- Automated high-end polishing systems
-
研磨拋光製程陶瓷零件｜高潔淨高硬度機構件
產品介紹
研磨拋光製程（CMP / Lapping / Polishing）廣泛應用於半導體晶圓表面處理、光學鏡片、陶瓷基板與金屬膜平坦化等工藝。此類製程對設備零件的硬度、潔淨度、尺寸穩定與耐磨性要求極高。徽亞科技提供一系列高性能陶瓷零件，支援長時間使用與化學穩定性需求。
常見陶瓷零件類型
- 載具環（Retaining Ring）
- 導水環 / 擋液罩（Splash Ring / Barrier）
- 壓板襯墊（Backing Plate / Pad Support）
- 拋光平台基座 / 保護蓋板（Polishing Base / Top Plate）
- 研磨定位塊、吸附定位結構件
可用材料
- 氧化鋁（Al₂O₃）：高硬度、高耐磨、性價比高
- 碳化矽（SiC）：極高耐化學性與機械強度
- 氮化鋁（AlN）：適用熱平衡載板與導熱模組
- 抗靜電陶瓷：避免顆粒靜電吸附，提升潔淨度
- 工程塑膠（如 PEEK）：用於襯墊與導水環等非結構件
應用產業
- 半導體晶圓 CMP 拋光設備
- 光學玻璃、藍寶石基板加工
- 精密金屬表面研磨與鍍層整平
- 高端拋光機 / 自動化加工平台
Ceramic Components for Polishing & Grinding Process
Product Overview
The polishing and grinding process (CMP / Lapping / Surface Finishing) plays a key role in wafer surface preparation, optical substrate processing, and precision film planarization. These systems demand wear-resistant, ultra-clean, and dimensionally stable ceramic parts for reliable performance in abrasive and chemical environments.
Typical Ceramic Parts
- Retaining Rings
- Splash Barriers / Liquid Shields
- Back Pads / Pressure Plates
- Polishing Base Plates / Top Covers
- Positioning Guides / Suction Fixtures
Available Materials
- Alumina (Al₂O₃): high hardness and wear resistance
- Silicon Carbide (SiC): top chemical resistance and rigidity
- Aluminum Nitride (AlN): thermal balance and base plate use
- ESD-safe ceramics: avoid particle electrostatic attraction
- PEEK / PTFE: used in non-structural buffer or drainage parts
Industries Served
- Semiconductor CMP wafer tools
- Optical & sapphire substrate polishing
- Precision metal grinding and film leveling
- Automated high-end polishing systems
